1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
입자 크기 | 15-53μm |
유동성 | ≤ 20 초 |
느슨한 밀도 | ≥4.9g/cmXNUMX |
산소 함량 | ≤300ppm |