1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Cocok untuk proses pencetakan lapisan tebal
ukuran partikel | 15-53μm |
Mobilitas | ≤ 20 d |
Kepadatan Longgar | ≥4.9g/cm³ |
Kandungan Oksigen | ≤300ppm |