1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
Rozmiar cząsteczki | 15-53μm |
Ruchliwość | ≤ 20 s |
Luźna gęstość | ≥4.9 g/cmXNUMX |
Zawartość tlenu | ≤300ppm |