1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
Partikkelstørrelse | 15-53μm |
Mobilitet | ≤ 20-tallet |
Løs tetthet | ≥4.9g/cm³ |
Oksygeninnhold | ≤300ppm |