1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
Tamaño de partícula | 15-53μm |
Movilidad | ≤ 20 s |
Densidad suelta | ≥4.9 g / cm³ |
Contenido de oxígeno | ≤300ppm |