1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
Partikelstørrelse | 15-53μm |
For at give mobilitet med container. (SOC-certifikat) | ≤ 20 sek |
Løs tæthed | ≥4.9g/cm³ |
Iltindhold | ≤300ppm |