1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
Partikelstorlek | 15-53μm |
Fordon | ≤ 20-talet |
Lös densitet | ≥4.9g/cm³ |
Syreinnehåll | ≤300ppm |