1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
Величине честица | КСНУМКС-КСНУМКСμм |
Мобилност | ≤ 20с |
Лоосе Денсити | ≥4.9г/цм³ |
Садржај кисеоника | ≤КСНУМКСппм |