1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
velikost delcev | 15-53μm |
Mobilnost | ≤ 20 s |
Loose Density | ≥4.9 g/cm³ |
Vsebnost kisika | ≤300ppm |