1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Piemērots biezslāņa drukas procesam
Daļiņu izmērs | 15-53μm |
Kustīgums | ≤ 20 s |
Brīvs blīvums | ≥4.9g/cm³ |
Skābekļa saturs | ≤300ppm |