1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
粒径 | 15-53μm |
可動性 | ≤20秒 |
疎密度 | ≥4.9g/cmXNUMX |
酸素含有量 | ≦300ppm |