1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
Particle size | 15-53μm |
Mobility | ≤ 20s |
Loose Density | ≥4.9g/cm³ |
Oxygen Content | ≤300ppm |