1. High copper purity, with a copper content of up to 99.95%;
2. High thermal conductivity & high electrical conductivity.
Particle size | 15-53μm,15-38μm,5-25μm |
Mobility | ≤ 20s |
Loose Density | ≥4.9g/cm³ |
Oxygen Content | ≤300ppm |
Tensile Strength | ≥240MPa |
Yield Strength | ≥165MPa |
Elongation Rate | ≥30% |