1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
velikost částic | 15-53μm |
Pohyblivost | ≤ 20 s |
Volná hustota | ≥4.9 g/cm³ |
Obsah kyslíku | ≤300ppm |